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For additional information please contact: Jim Ayars,
Presidentor Jack McNally,
Vice Presidentat J&J Technologies Inc. 18 Kendrick Road Wareham, MA 02571 Phone: 508.291.3803 Fax: 508.291.1720 www.jjtech.tv |
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- Surface Mount - Solder paste printing, pick & place, reflow (hot air convection), inspection and rework.
- Through-Hole - Wave solder (lead and lead free), inspection, rework, and aqueous cleaning.
- Electro-Mechanical - Final product assembly including the assembly and integration of chassis, power supply, cables and functional test.
- Testing - In-circuit, functional, Quality Assurance testing.
- Solder - Lead-free (SN/Ag/Cu), (SN) and eutectic (Sn63/Pb37), both no-clean and water soluble.
- Prototype - The ability to respond to design changes typical at the prototype and pre-production stages.
- Failure Analysis - X-ray joint evaluation, micro-sectioning.
- AOI (Automated Optical Inspection) - Unsurpassed defect detection.
- Full Turnkey Capabilities - Purchasing, incoming inspection, secure stock area.
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Production floor |
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X-Ray Evaluation Mirtec AOI | |
- Rigid and flexible printed circuit boards, FR-4, G-10, Rogers, Polyimide, Kapton, Teflon. HASL, OSP, Immersion tin, Immersion silver, ENIG and gold plating, IS-410 (RoHS/lead free compatible).
- Single or double sided printed circuit board assembly with both pure or mixed technology components.
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- Thermal Clad (T-Clad).
- Populate all component types including BGA, uBGA, multichip modules, fine pitch and quad flat packages.
- Conformal coating with acrylic and urethane based materials.
- Omega cleanliness testing.
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